Sarmah, A. Desai, S. K. Crowley, A. G. Zolton, G. C. Tezel, G. B. Harkin, E. M. Green, M. J. text xx 9999 monographic und

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Direct Ink Writing (DIW)is an extrusion-based additive manufacturing method where the print medium is a liquid-phase 'ink' dispensed out of nozzles and deposited along digitally defined paths. Conventional DIW of thermosetting resins relies on viscosity modifying agents, novel crosslinking chemistries, and/or long curing schedules in an oven. Here we demonstrate the use of a co-planar radio frequency applicator to generate an electric field, which can be used to rapidly heat and cure nano-filled composite resins as they are printed. This method avoids the need for an oven or post-curing step. This process consists of a sequential print-and-cure cycle which allows for printing of high-resolution, multi-layered structures. Every extruded layer is partially cured using RF before depositing the next layer; this allows the printed part to maintain structural integrity. The process enables both increased throughput and decreased touch time relative to traditional manufacturing. Commercial epoxy resin with varied nano-filler loadings were examined as DIW candidates. After printing, the thermo-mechanical properties, surface finish, and shape retention of RF-cured samples were comparable to conventionally cured samples. This method of manufacturing establishes RF heating as a suitable alternative to conventional methods, facilitating rapid, free-form processing of thermosetting resins without a mold. DIRECT INK WRITING RADIO FREQUENCY HEATING THERMOSETTING RESIN FREE-FORM PROCESSING https://drive.google.com/file/d/1qgSejbwXX554xKlBPuwNLg-ZLxmdMszb/view?usp=drivesdk https://drive.google.com/file/d/1qgSejbwXX554xKlBPuwNLg-ZLxmdMszb/view?usp=drivesdk 250602 20260521091706.0