Microelectronics Technology -- Reliability Practice -- Thermal Management -- to Advanced Mechanics -- Thermo-Mechanics of Integrated Circuits and Packages -- Characterization and Modelling of Moisture Behaviour -- Characterization and Modelling of Solder Joint Reliability -- Virtual Thermo-Mechanical Prototyping -- Challenges and Future Perspectives.

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.